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2008 Intel Embedded and Communications Education Summit

 

When: Monday - Tuesday, February 11 - 12, 2008
Where: Chandler, AZ USA
What: A valuable opportunity to share your research pursuits with Intel architects and academic colleagues from around the globe.
Learn about the latest Intel architecture, hardware and software solutions in embedded and communications computing.
Register Online!: Click here to fill out our online registration form.

AGENDA HIGHLIGHTS

Lightning Round: All attendees will be given time to share their research interests and current work.

 

Tech Talk and Open Forum
with Karl G. Kempf

Intel Fellow, Technology and Manufacturing Group
Director,  Decision Technologies
INTEL CORPORATION

 

University Research Presentations

  • Patrick Crowley - University of Washington, St. Louis: “A Hybrid Automation for High-Speed Evaluation of Sets of Complex Regular Expressions”
  • Ada Gavrilovska- Georgia Institute of Technology:  “On the feasibility of Multi-threading Imaging Applications”
  • Yan Luo - University of Massachusetts, Lowell: “Performance Evaluation of Regular Expression Matching using Intel IXP Network Processors”
  • David Salyers, University of Notre Dame: “OWB: Opportunistic Wireless Broadcast”
  • Tilman Wolf- University of Massachusetts Amherst: “Application-Layer Offloading using the IXP 2850”

Invited Guest Presentation

  • Prof. HS Jamadagni - Indian Institute of Science: "Realizing R&D: How Indian Universities Collaborate with Government and Industry Partners to Bring Research to the Marketplace"

Tour: An inside look at Intel's Arizona IA Hardware Labs

Intel Presentation Topics

  • Intel Worldwide Higher Education Program Overview
  • Multicore Intel Architecture
  • Live Demos of Intel's System-on-a-Chip Platform and other technologies




Southwestern Dinner/Reception - Rustler's Rooste
Monday Evening

KEYNOTE SPEAKERS

Eugene S. Meieran

Intel Senior Fellow,  Technology and Manufacturing Group
Director, Manufacturing Strategic Support
INTEL CORPORATION

"Technology Challenges for the 21st Century"

Eugene S. Meieran, Intel Senior Fellow, transferred to Intel Research in CTG in 2007 after spending 34 years in TMG. He is working on introducing advanced innovation and collaboration technology into Intel to help improve internal overall business performance.

Meieran joined Intel Corporation in 1973 as manager of package development (now ATD), with responsibility for developing new lines of device packages for the emerging memory and microprocessor product lines. In 1977 he transferred to the Quality and Reliability Department, responsible for Intel incoming materials quality, creating the new Materials Analysis Laboratories and for key elements of the manufacturing quality and reliability functions. In 1985, he was appointed as Intel Fellow, the second in the company's history. In 2007, he transferred from TMG to CTG.

He is currently a member of the Intel Research Council and the Intel Academic Relations Council, and was Intel's representative to the Semiconductor Research Corp. (SRC) Factory Sciences Board. He has received two Intel Achievement Awards.

 

Hang Nguyen

Principal Engineer
Embedded and Communications Group
INTEL CORPORATION

"Platform Repartitioning: Moving Closer to Achieving Disparate Demands of Performance and Power"

Hang worked at General Electric Semiconductor from 1984-1987 and has been with Intel since 1987. She has worked on several areas of Integrated Circuit designs, from I/O, logic, and memory designs to CPU Architectures and Micro-architectures. She also ventured into board-level designs and compiler performance analysis. She is currently the lead architect for an Intel server-class product for the embedded market. Her current areas of interest include reliability research, on-die interconnects, low power technologies and especially mentoring women engineers.

Visit the University Program Web Site
or contact admin@ixaedu.comfor additional info.